| Classification | Standard | Maximum |
|---|---|---|
| Maximum number of layers | 1Layer ~ 32Layer | +a |
| Minimum thickness of copper | 1/3 oz (12㎛) | |
| Maximum thickness of copper | 4/4 oz (144㎛) | |
| Minimum thickness of board | 0.6T | |
| Maximum thickness of board | 3.2T | |
| Maximum size of panel | 600mm × 640mm | |
| Impedance control | ±10% | ±5% |
| BGA pitch | 0.4mm | 0.3mm |
| Surface finish | Standard | Maximum |
| HASL ( LF HASL) | 7㎛ ~ 8㎛ | |
| ENIG | 0.03㎛ | +a |
| OSP | ||
| Drill | Standard | Minimum |
| 1.6T | 0.15mm | 0.1mm |
|
